Eaton JMXFD1G02FSUDSU Push-Pull Connector - IP50
Part Number: JMXFD1G02FSUDSU
Quick Summary
The Eaton Souriau JMXFD1G02FSUDSU is a plastic push-pull connector for robust panel wiring. Engineers often struggle with secure mating under vibration and field maintenance challenges. This solution delivers IP50 protection, UL94 V0 flammability, and RoHS/REACH compliance to meet strict industry standards and keep assemblies compliant. Its compact 55 mm length and 18.5 mm footprint, 2-contact layout, and gold-plated solder-cup contacts support quick installation and reliable signal and power transfer. The straight plug and sealing gland backshell simplify panel mounting, while the 10 A rating and -40 to 125 °C operating window provide resilience in demanding industrial environments. This combination translates to lower lifecycle costs and faster time-to-value for automation projects.
Product Information
Extended Description
JMXFD1G02FSUDSU Eaton: Push-pull plastic IP40 plug, layout 1-02, female solder contacts, keying G, without color coding; JMXFD1G02FSUDSU
Product Name
Eaton Souriau JMX series plastic push-pull connector
Catalog Number
JMXFD1G02FSUDSU
Product Length/Depth
55 mm
Product Height
18.5 mm
Product Width
18.5 mm
Product Weight
12 g
Current rating
10 A IEC 10 A UL
Environmental conditions
Flammability rating UL94 V0 REACH RoHS
Backshell angle
Straight
Backshell type
Sealing Gland
Connector accessory option
Delivered with connector
Connector type
Plug
Contact gender
Socket (Female)
Contact plating
Gold
Contact type
Solder Cup
Coupling type
Push-Pull
Degree of protection
IP50
Layout
2
Plug type
Straight Plug
Shell material
Plastic
Shell size
1
Mating cycles
2000
Operating temperature - max
125 °C
Operating temperature - min
-40 °C
Number Of Contacts
2
Push-pull coupling enhances mating reliability, reducing installation time and wear on contacts. In control panels and robotics, this means fewer alignment issues during harnessing and faster commissioning. Gold-plated solder cup contacts offer superior corrosion resistance and consistent conductivity for 10 A circuits, delivering stable performance in high-temperature environments and extending connector life in automation enclosures. The 2-contact layout with a straight plug and sealing gland backshell simplifies wiring and field servicing, enabling quicker maintenance and denser panel designs. With 2000 mating cycles, IP50 protection, and a wide operating range (-40 °C to 125 °C), this solution minimizes unplanned downtime and guarantees dependable operation in factory floors. The compact 55 mm length and 18.5 mm footprint save space, supporting compact automation architectures and flexible I/O design.
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FAQs
When installing the JMXFD1G02FSUDSU, ensure correct alignment of the 2-contact layout and secure mating with the straight plug. Use the sealing gland backshell to maintain IP50 performance in dusty environments, and route the harness to minimize strain on solder cups. Confirm operating temperature range (-40 °C to 125 °C) is suitable for the application and verify RoHS/REACH compliance for your system.
This connector provides a 10 A current rating for IEC/UL applications and uses gold-plated solder cup contacts in a socket (female) configuration. It features a 2-contact setup with layout 2, designed for reliable power and signal transfer in automated equipment.
Yes, it suits many industrial automation uses such as control panels, robotics, and conveyors. Its IP50 protection, high-temperature tolerance, and robust mating cycles make it viable for moderate dusty environments and vibration, while the compact footprint supports dense panel designs commonly found in machinery and process automation.
The JMXFD1G02FSUDSU carries UL94 V0 flammability rating, and is RoHS and REACH compliant, with IP50 protection for environmental sealing. These certifications help ensure safety, compliance, and suitability for global industrial applications.
With 2000 mating cycles, gold-plated contacts, and a sealing gland backshell, the connector delivers durable performance and lower replacement frequency. The compact form factor reduces panel space, enabling denser I/O designs and faster commissioning, which translates to shorter downtime and lower lifecycle costs in automation projects.